As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...
As three-dimensional integrated circuit technology becomes the architectural backbone of AI, high-performance computing (HPC) ...
With the rapid rise of emerging technologies such as AI, high-performance computing (HPC) and 5G, demand for improved chip ...
SEMIFIVE, a leading provider of custom AI semiconductor (ASIC) design, held an IPO press conference on Decembe ...
As more AI GPU, CPU, and ASIC customers ramp up their market push, advanced packaging capacity continues to face tight supply ...
Taiwan Semiconductor Manufacturing Co. (TSMC) recorded its highest number of shareholders in nearly eight months this week, even as its share price dropped. The number of people owning shares in the ...
Moona shares two aspects of sustainability, the importance of learning the standards, and how “burnout” can actually be a ...
Validated by early deployments at leading semiconductor companies, Vinci’s physics-driven AI software operates up to 1000x faster than conventional si ...
SEMIFIVE, a global leader in custom AI semiconductor (ASIC) design preparing for its KOSDAQ listing, announced today that it ...
With copper interconnects facing limitations amid growing AI data workloads, silicon photonics – using light to transmit data - is developing rapidly to support the ultra-high bandwidth, low latency, ...
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Cadence Design Systems, Inc. (CDNS) Presents at 53rd Annual Nasdaq Investor Conference Transcript
Cadence Design Systems, Inc. (CDNS) 53rd Annual Nasdaq Investor Conference December 9, 2025 5:00 AM ESTCompany ParticipantsAnirudh Devgan - CEO, ...
United Microelectronics Corporation (UMC), the giant Taiwan-headquartered chip foundry, has signed a licensing deal to ...
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