Science Daily

This new 3D chip could break AI’s biggest bottleneck

Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically ...

The 3D-printed shoe company that wants to follow Apple’s lead

Sam Altman's OpenAI, the company behind ChatGPT, has launched its first-ever certification courses designed for workers and ...
Tech Xplore

One pull of a string is all it takes to deploy these complex structures

MIT researchers have developed a new method for designing 3D structures that can be transformed from a flat configuration ...
The Malaysian Reserve

Greneta Unveils AI-Powered ‘Optimizer 2.0’ at CES 2026; Solves Spatial Computing’s Data Bottleneck with 99.6% Compression

Named a CES 2026 Innovation Award Honoree, Greneta's new engine transforms massive industrial 3D assets into streamable ...

ZenaTech Closes Acquisition of Vara 3D, a Utah-Based Surveying and Mapping Firm Expanding Drone-as-a-Service to the High-Growth Solar Infrastructure Market

Closing the acquisition of Vara 3D both expands our service capabilities and accelerates entry into a high-growth market with significant long-term potential,” said Shaun Passley, Ph.D., ZenaTech CEO.
Semiconductor Engineering

3D-IC Market Outlook: Technology Roadmaps, Readiness, And Design Implications

Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.
Business Wire

Visual Noise, PRG, and Disguise Power Visual Experience for Thousands of Fans at MDLBEAST Soundstorm

Today, Visual Noise, Disguise and PRG announced the successful completion of their work on MDLBEAST Soundstorm 2025, combining creative, technical and ...