This New 3D Chip Could Shatter the “Memory Wall” Holding Back AI

Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...

AI calculations on Mac cluster get big boosts from new RDMA support on Thunderbolt 5

Real-world test of Apple's latest implementation of Mac cluster computing proves it can help AI researchers work using ...
IEEE

A Large Language Model-Based System for Socratic Inquiry: Fostering Deep Learning and Memory Consolidation

Abstract: This paper introduces a novel Large Language Model (LLM)-based system designed to enhance learning effect through Socratic inquiry, thereby fostering deep understanding and longterm ...
IEEE

3D-TokSIM: Stacking 3D Memory with Token-Stationary Compute-in-Memory for Speculative LLM Inference

Abstract: The LLM decoding process poses a significant challenge for memory bandwidth due to its autoregressive nature. Prior 2D memory solutions fail to overcome this memory bottleneck due to limited ...