Abstract: The transition from tin-lead to lead-free solders, prompted by increasing environmental and health concerns, led to the consideration of the SAC (Tin-Sn, Silver-Ag, and Copper-Cu) solder ...
Abstract: This paper presents a novel radix-4 division by recurrence architecture that utilizes a hierarchical Signed-Digit (SD) adder. The implementations are easily generated based on the ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results