The FICS Research Institute (University of Florida) has published a new research paper titled “Secure Physical Design.” This is the first and most comprehensive research work done in this area that ...

Historically IC package design has been a relatively simple task which allowed the die bumps to be fanned out on a package substrate to a floorplan geometry suitable for connecting to a printed ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

The landscape of IC design is experiencing a profound transformation. With the physical and economic limits of conventional two-dimensional scaling, the industry is rapidly embracing three-dimensional ...

Development of the complex ICs in these devices requires advanced design techniques and nanometer process geometries, standards that conventional design solutions are not equipped to handle. The ...

Xinyx IC Design B.V. is a 100% Filipino owned IC Design house and has been in operations since 2009, with more than a decade of experience in the field of integrated circuit design, giving its clients ...