The designs of an IC, its package and its target system board have traditionally been separate development processes driven from common specifications. The system designer has typically relegated ...

Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...

Surface-mount technology (SMT) is evolving far beyond its roots as a way of assembling packaged chips onto printed circuit boards without through-holes. It is now moving inside packages that will ...

January 29, 2014. ANSYS at DesignCon debuted new functionality for ANSYS SIwave. ANSYS’ electromagnetic (EM) simulation suite for the design of high-speed printed circuit boards (PCB) and integrated ...

MEYREUIL, France & SAN JOSE, Calif.--(BUSINESS WIRE)--Presto Engineering, an ASIC design and outsourced operations provider, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced a ...

Advanced packaging techniques are viewed as either a replacement for Moore’s Law scaling, or a way of augmenting it. But there is a big gap between the extensive work done to prove these devices can ...

Issues in GDDR6 design. In-design analysis for signal integrity and power integrity. Innovative workflow for GDDR6 design and analysis. Graphics processing units (GPUs) and graphics double-data-rate ...

Do you have a 5 V device you want to run 24/7, no matter whether you have electricity? Not to worry – Linear Technology has made a perfect IC for you, the LTC4040; with the perfect assortment of ...

Collaboration Provides Insight on IC Packaging Trends and Delivery of State-of-the-Art IC Package Design Services “We are pleased to collaborate with Cadence, a leader in electronic design software, ...