Nvidia Corporation is set to implement a new advanced packaging technology called Chip-on-Wafer-on-Platform PCB (CoWoP) for its next-generation GR150 AI GPU, expected to launch in 2027. This approach ...

The first article in this series titled “The common silicon issues in analog IP integration” focused on system-on-chip (SoC) design issues related to incorporating analog IP. Here we begin expanding ...

A significant divergence emerged as Taiwan and China concluded their major PCB industry exhibitions in late October 2025. While Taiwanese manufacturers focused on supply bottlenecks for copper-clad ...

TL;DR: NVIDIA is exploring CoWoP PCB packaging for its next-gen Rubin R150 AI GPUs, offering improved signal and power integrity, enhanced thermals, and reduced costs by eliminating the package lid.

Immediately prior to the release of the Nvidia GeForce RTX 3090 Ti, there were more than a few rumours suggesting that the technology, and specifically the PCB, utilised within the design was ...