The need for speed to process neural networks is far less a matter of processor capabilities and much more a function of memory bandwidth. As the compute capability rises, so too does the need to keep ...
Imec presents the first comprehensive thermal study of 3D HBM-on-GPU integration using a system-technology co-optimization ...
In 2014, 3D NAND flash was introduced to the industry with 24 layers, and it co-existed with 2D NAND flash until 2017. 3D NAND flash gradually came to dominate the market with its high-density storage ...
Artificial intelligence computing startup D-Matrix Corp. said today it has developed a new implementation of 3D dynamic random-access memory technology that promises to accelerate inference workloads ...
Want smarter insights in your inbox? Sign up for our weekly newsletters to get only what matters to enterprise AI, data, and security leaders. Subscribe Now A team of researchers from leading ...
and Micron Technology recently announced a new memory technology called 3D XPoint, and it’s creating a lot of buzz. This buzz continued during last August’s Intel Developer Forum with Intel’s ...
One of the most fundamental problems in modern silicon is known as the processor-memory performance gap. The term, which has been used for decades, refers to the well-known tendency for CPUs to ...
Micron announced that it will increase its investment in memory products that leverage the Compute Express Link (CXL) and that it is ceasing development of its 3D XPoint technology. The company said ...
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