HSINCHU, Taiwan & SAN JOSE, Calif.--(BUSINESS WIRE)--United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, and Cadence Design Systems, Inc.

3D-ICs are proving a challenge even for designers accustomed to dealing with power and performance tradeoffs, but they are considered an inevitable migration path for leading-edge designs due to the ...

Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...

Speeding time to market, the Cadence 3D-IC reference flow, featuring the Integrity 3D-IC platform, has been certified for UMC’s chip stacking technologies. UMC’s hybrid bonding solutions support the ...

Siemens has introduced Siemens’ electronic design automation software to enhance its power devices and analogue semiconductor ...

Worse, the most recent CERN implementation of the FPGA-Based Level-1 Trigger planned for the 2026-2036 decade is a 650 kW system containing an incredibly high number of transistor, 20 trillion in all, ...

As three-dimensional integrated circuit technology becomes the architectural backbone of AI, high-performance computing (HPC) ...

TSMC is advancing system-level innovation by improving the 3D IC design ecosystem through enhanced collaboration with foundries, customers, and partners, according to a recent blog post. The latest ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the leading Cadence ® Integrity ™ 3D-IC platform has achieved certification for and met all reference ...

The relentless pursuit of higher performance and greater functionality has propelled the semiconductor industry through several transformative eras. The most recent shift is from traditional ...

United Microelectronics (NYSE:UMC) and Cadence Design Systems (NASDAQ:CDNS) collaborate on the Cadence 3D-IC reference flow, featuring the Integrity 3D-IC Platform, certified for UMC’s chip stacking ...

United Microelectronics (UMC) and Cadence Design Systems have jointly announced that the Cadence 3D-IC reference flow has been certified for UMC's chip stacking technologies. Save my User ID and ...